Call for Papers

Call for Papers

Key Date

  • Submission of Regular Papers
    Feb 4, 2022 February 11, 2022
  • Notification of Paper Acceptance
    Mar 25, 2022
  • Camera-ready Submission
    Apr 15, 2022

Artificial Intelligence (AI) is driving the new revolution of not only the information technology but also all other industries. New algorithms and application systems are introduced with the power of AI. New computing platforms are required to support the emerging AI algorithms and applications, from cloud servers to edge devices, from system level to circuit level.
Facing this new challenge and opportunity, the AICAS Conference is established to facilitate the state-of-the-art research, innovation and development activities at the frontiers of Artificial Intelligence circuits and systems. It serves as the best platform allowing scholars, technological researchers, and industry from both domestic and international communities to exchange experiences, and demonstrate their studies and further advance AI technologies on circuits and systems.
This conference brings together members of our communities to broaden their knowledge in emerging areas of research at the field of Artificial Intelligence and the circuits and systems. The three-day program for AICAS 2022 is multidisciplinary in topics including but not limited to:

  • Circuits and systems for AI
  • Deep learning/machine learning/AI algorithms
  • Tools/platforms for AI
  • Architecture for AI computing
  • Hardware/software co-design and design automation for AI systems
  • Advanced neural network design
  • Neuromorphic circuits, processors, and systems and their applications
  • Emerging applications: Internet-of-things, healthcare, smart factories, environment
  • Emerging devices and materials for AI
  • Computer vision algorithms and architectures
  • Recommendation system, language/text processing
  • Autonomous/unmanned vehicles and drone
  • Robotics and automation
  • Metaverse and AR/VR
  • Deep learning/machine learning for Future Wireless Communications

Call For Papers Download

Technical Program Co-Chairs
Won Woo Ro
Yonsei University, Korea
wro@yonsei.ac.kr
Shi-Peng Li
Shenzhen University, China
lishipeng@cuhk.edu.cn
Boris Murmann
Stanford University, USA
murmann@stanford.edu
Kyung Ki Kim
Daegu University, Korea
kkkim@daegu.ac.kr